Full workflow support on surface morphology and ultrastructural analysis in SEM and TEM

Single-particle analyses performed using TEM after negative staining

Correlative light/electron microscopy (CLEM)

Workflow including sample preparation, 2P microscopy, confocal microscopy, light sheet microscopy, ophthalmic imaging/OCT/ERG and image analysis.

Workflow from sample preparation, MET and cryo-confocal, advanced photonic microscopy
WF/confocal/FLIM, CLEM, image analysis (AMIRA)

Talos F200X G2

As Volume EM techniques we offer Electron Tomography and Serial Blockface Scanning Electron Microscopy. The targeting of a precise ROI can be achieved by integrating Light Microscopy or X-ray imaging in the pipeline.

Sample preparation is essential to observe biological samples in electron microscopy. Imagerie-Gif facility propose all the equipment to cover a large diversity of application: chemical fixation, high pressure freezing, resin embedding, ultramicrotomy and cryo-ultramicrotomy. They also propose elaboration of immunolabeling on resin section or cryosections. The observation of sections are made by TEM for high resolution imaging, or by SEM for large field and 3D acquisition.

Ultrastructural studies in transmission electron microscopies (2D -3D) for plant sciences and animals sciences: from sample preparation (conventional and cryogenic conditions), to imaging & data processing
(Key-words: Tokuyasu, Immunolabelling, TEM, SBF, tomography, 3D reconstructions, segmentation, image analysis)

Chemical and ultrastructural imaging in electron microscopy for environmental sciences and ecotoxicology: from sample preparation (conventional and cryogenic conditions), to imaging & data processing (Key-words: TEM HR, EDS, STEM-EDS, SEM-EDS, cryoSEM-EDS)

The platform offers advanced cryofixation protocols, using a high-pressure freezer (Wohlwend Compact 03) and a cryosubstitution unit (Leica AFS). Sections are prepared by ultramicrotomy and observations are made by TEM for high resolution imaging, or by SEM for large field and 3D acquisition.